BGA/CSP rework and reballing
From one piece to mass production, we respond with short lead times! Feel free to leave special modifications (jumpers) to us!
At AIM, we handle various rework related to BGA, including the installation and removal of BGA/CSP, as well as the reballing of removed BGAs. We undertake 500 items of BGA rework and 200 items of reballing annually. Over 20 years of handling various products and circuit boards has allowed our technical department to accumulate a vast amount of know-how. We can respond to both rework and reballing requests from one piece to mass production with a short lead time. 【Features】 ■ Abundant track record and experience ■ Removal of BGA underfill ■ Standard rework masks and various solder balls in stock ■ ISO 9001 certified and obtained in 1998 ■ Installation of interposers and rework of PoP devices are also possible *For more details, please refer to the PDF document or feel free to contact us.
- 企業：エイム
- 価格：Other
